The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2000
Filed:
Feb. 19, 1998
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B / ; C03B / ; C03B / ; C03B / ; C03B / ;
U.S. Cl.
CPC ...
65305 ; 65 26 ; 65 36 ; 65305 ; 6537411 ; 249116 ; 428633 ;
Abstract
A press-molding die comprises a base material, an intermediate layer formed on a surface of the base material and a protective layer formed on the intermediate layer. The base material comprises an inorganic oxide. The intermediate layer comprises a material that adheres to both the base material and the protective layer and is heat resistant at high temperatures wherein the die is used. The protective layer comprises at least one metal film selected from the group consisting of tungsten (W), platinum (Pt), palladium (Pd), rhodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), rhenium (Re), tantalum (Ta) and alloys thereof.