The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Jun. 24, 1998
Hirayoshi Tanei, Yokohama, JP;
Shoichi Iwanaga, Yokohama, JP;
Masahide Okamoto, Yokohama, JP;
Masato Nakamura, Fujisawa, JP;
Kousaku Morita, Zama, JP;
Shousaku Ishihara, Chigasaki, JP;
Fumikazu Tagami, Hadano, JP;
Norio Sengoku, Hadano, JP;
Tsuyoshi Fujita, Yokohama, JP;
Fumiyuki Kobayashi, Sagaminara, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Ceramic circuit substrate which is sintered at 900 to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850 to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.