The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Apr. 08, 1998
Lance Kaufman, Scottsdale, AZ (US);
Teledyne Industries, Inc., Los Angeles, CA (US);
Abstract
An electronic assembly having one or more heat producing semiconductor components in the form of a chip or die has improved heat dissipation properties. The semiconductor components are formed into subassemblies comprising one or more of the semiconductor components bonded on opposite planar surfaces to metal lead frames. Each lead frame is bonded to a substrate which is electrically insulating and thermally conductive. The resulting assembly is submerged into a central channel of a heat sink. The channel is adapted to receive the assembly such that the channel walls compressingly engage the assembly. Heat is thereby dissipated from the semiconductor components from both planar surfaces of the component.