The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Jul. 01, 1998
Toshiya Ishio, Nara, JP;
Hiroyuki Nakanishi, Kitakatsuragi-gun, JP;
Katsunobu Mori, Nara, JP;
Katsuyuki Tarui, Kasaoka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A method of manufacturing a semiconductor device including two semiconductor chips having mutually different element forming face areas on respective surfaces of a die pad of a lead frame prepared by sealing the semiconductor chips with resin by setting the lead frame in a resin sealing use mold having an injection gate for injecting therethrough a sealing resin, includes the steps of: (a) mounting the semiconductor chips on respective surfaces of the die pad in such a manner that when setting the lead frame in the resin sealing use mold, a distance between a side face of the semiconductor chip having a larger element forming face area on the injection gate side and a side face of the semiconductor chip having a smaller element forming face area on the injection gate side becomes shorter than a distance when these semiconductor chips are mounted at a center on respective surfaces of the die pad; (b) setting the lead frame in the resin sealing use mold so that the above side faces of the semiconductor chips are positioned on the injection gate side; and (c) injecting the sealing resin from the injection gate.