The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Dec. 15, 1997
Norito Umehara, Oita, JP;
Masazumi Amagai, Beppu, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
To provide a type of semiconductor device with high resistance to cracks and having fewer manufacturing steps. Semiconductor device 1 has a substrate having insulating base material 2 mainly made of a thermoplastic polyimide resin. When heated to a temperature above the glass transition temperature, the surface of insulating base material 2 made of thermoplastic polyimide resin melts and exhibits the properties of an adhesive. The adhesive layer is preferred for laminating the metal film for forming conductor pattern 3, and it is preferred for fixing semiconductor IC chip 4 to insulating base material 2 made of thermoplastic polyimide resin. When semiconductor IC chip 4 is fixed on insulating base material 2 made of thermoplastic polyimide resin, the two are brought into contact with each other under a prescribed pressure, and the atmospheric temperature is higher than the glass transition temperature for bonding. Frame 6 made up of a metal lead frame is arranged on the periphery of the insulating base material for reinforcing insulating base material 2 made of thermoplastic polyimide resin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile