The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Feb. 19, 1999
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An adhesive tape for lead-on-chip (LOC) IC applications containing a polyamide-based adhesive composition which is the reaction product from a reaction mixture of: (a) a pre-imidized polyamic acid; and (b) a bismaleimide that has been modified by a barbituric acid of a derivative of barbituric acid to become a barbituric acid modified bismaleimide. The pre-imidized polyamic acid is a reaction product from a reaction mixture that contains a polyamic acid and a cyclizing agent. The polyamide-based adhesive composition provides all the desirable heat resistance and other mechanical and dielectric characteristics. But, most significantly, its microscopic rheological properties are adjusted such that excellent contact is achieved between the resin molecules and the lead frame surface while eliminating or at least minimizing the extent of adhesive overflow, which can substantially reduce the reliability of the final IC product.