The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2000

Filed:

Feb. 06, 1998
Applicant:
Inventors:

Koichi Hoshino, Obu, JP;

Tetsuya Katayama, Aichi-gun, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438172 ; 438180 ; 438571 ; 438577 ;
Abstract

An insulating layer is formed on a semiconductor substrate, and a first resist layer having a first resist opening portion is formed on the insulating layer. Then, the insulating layer is etched thought the opening portion to expose the substrate. After removing the first resist layer, a second resist layer having second resist opening portions are formed. One of the second resist opening portions is provided to expose the substrate, and a recess is formed in the substrate through the opening portion. Further, the insulating layer exposed from the other of the second resist opening portions is removed. Then, an electrode member for gate, source, and drain electrodes is deposited on the substrate. As a result, variations in intervals between the gate and drain electrodes and between the gate and source electrodes can be reduced.


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