The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
May. 15, 1997
Applicant:
Inventors:
Yuuji Hotta, Osaka, JP;
Hitomi Shigyo, Osaka, JP;
Assignee:
Nitto Denk Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; H01L / ;
U.S. Cl.
CPC ...
428 67 ; 257678 ; 257729 ; 428 421 ; 428209 ;
Abstract
A method of manufacturing a semiconductor and a lamination therefor, in which fixing materials are temporarily fixed to the molding faces of a mold through release films. The semiconductor element is then placed in the mold and molding resin is injected into the mold. The resin is heated to produce the semiconductor device. During this process, the fixing materials become embedded in each of the opposite surfaces of the resin.
Hotta, Yuuji. (2000). Semiconductor device and a lamination and fixing material used in the (U.S. Patent No. 6117513). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6117513
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile