The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Sep. 17, 1997
Morimitsu Tanaka, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A chemicomechanical polishing (CMP) apparatus for polishing a semiconductor wafer of the present invention includes a polishing pad and a wafer carrier disposed above the pad. A slurry feed port is positioned upstream of, but in the vicinity of, the wafer carrier in the direction of rotation of the polishing pad. Slurry is fed to the wafer supported by the wafer carrier via the slurry feed port. A slurry removing device is positioned downstream of the wafer carrier in the above direction. A conditioning mechanism for conditioning the pad is interposed between the wafer carrier and the slurry removing device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile