The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2000

Filed:

Nov. 13, 1998
Applicant:
Inventor:

David L Hall, Salt Lake City, UT (US);

Assignee:

Iomega Corporation, Roy, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B / ; G11B / ;
U.S. Cl.
CPC ...
3602342 ; 3602369 ;
Abstract

An improved head assembly, that may be disposed on an actuator of a disk drive, includes a pair of sliders for interfacing with a data storage medium of a data storage cartridge. The improved head assembly of this invention includes a first and a second slider that each have a pair of longitudinal rails. These rails preferably extend parallel to the longitudinal axis of the respective slider. The first slider and the second slider each have a slot in one of their longitudinal rails. The sliders are oriented so that the slotted rail of each slider is aligned with an unslotted rail of the other slider. When a storage medium is rotated between the sliders a pressure is created between the storage medium and each of the sliders. Air pressure is bled from the area that is proximal to the slots to create areas of low pressure proximal to the slots. Because of this area of low pressure, the storage medium deflects proximal to the trailing edges of the slotted rail of each slider. Since the head assembly may have a sensor disposed proximal to each slot, the storage medium deflects toward the sensors in the sliders. By deflecting the storage medium toward the sensors, the communicative signal between the head assembly and the data storage medium is enhanced.


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