Ball grid array (bga) semiconductor package member

Abstract

The present invention relates to a ball grid array (BGA) semiconductor package member and its manufacturing method employing a carrier frame and a substrate, and to a method of manufacturing a BGA semiconductor package using the BGA semiconductor package member. In manufacturing the conventional BGA semiconductor package, conventional package manufacturing equipment cannot be employed because a boat is used during processing which requires additional equipment, and thus increases the costs of production. However, a BGA semiconductor package manufacturing method employing a carrier frame and substrate according to the present invention is compatible with conventional semiconductor package manufacturing equipment. In other words, a BGA semiconductor package member is made by attaching a substrate having a multi-layer wiring therein onto a carrier frame having the same structure as a conventional lead frame, then a semiconductor chip is attached to the member and a wiring and molding processes are successively performed. The BGA semiconductor package manufacturing method according to the present invention allows computability with conventional manufacturing equipment, and automation and high speed processing of the overall manufacturing operation is achieved to thus minimize production costs and improve productivity.