The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Sep. 27, 1999
Stephen D DelPrete, Rehoboth, MA (US);
Thomas & Betts International, Inc., Sparks, NV (US);
Abstract
A leadless IC or other electronic circuit package socket is provided which is of simple construction providing low profile mounting of an IC package on a circuit board. The socket comprises a relative thin socket carrier having a plurality of resilient conductive columns extending between the top and bottom surfaces of the carrier and having alignment elements which are cooperative with elements on a circuit board on which the carrier is mounted to position the carrier on the circuit board such that the conductive columns are in registration and electrical contact with corresponding ones of contacts on the circuit board. An IC package or other circuit package has contacts on the bottom surface thereof in a pattern corresponding to the pattern of the resilient conductive columns of the socket carrier, and also has alignment elements cooperative with elements on the socket carrier to provide alignment of the package contacts and the conductive columns when the package is mounted on the socket carrier. A cover fits over the IC package and has snap fittings which engage cooperative openings or other elements of the circuit board to retain the IC package in electrical engagement with the circuit board via the socket carrier.