The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Jul. 08, 1998
Applicant:
Inventors:
Rickie C Lake, Eagle, ID (US);
Mark E Tuttle, Boise, ID (US);
Assignee:
Micron Communications, Inc., Boise, ID (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438653 ; 438108 ; 438611 ; 438613 ;
Abstract
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.
Quick Actions:
Lake, Rickie. (2000). Electronic circuit bonding interconnect component and flip chip (U.S. Patent No. 6114239). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6114239
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile