The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Feb. 24, 1998
Shigeya Kato, Kariya, JP;
Yasutaka Kamiya, Okazaki, JP;
Takashi Ogata, Kariya, JP;
Takashi Hiraiwa, Anjo, JP;
Denso Corporation, Kariya, JP;
Abstract
A method of forming a separation groove and a ditch for cutting a thermoplastic resin sheet by a laser beam is performed as follows. A heat-resistant layer made of thermosetting resin is printed on the rear surface of the resin sheet along the line of the ditch to be formed by the laser beam. A laser beam is radiated on the front surface of the resin sheet and scanned along the line of the ditch and the separation groove. The laser beam melts and evaporates resin and forms the ditch and the separation groove. Since the rear end of the ditch is covered by the heat-resistant layer, the resin sheet is not completely separated along the ditch line, while it is separated along the separation groove line. At the final stage, the resin sheet is cut along the ditch line. A flexible circuit sheet for making electrical connection can be easily and cost effectively processed in this laser beam process.