The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2000

Filed:

Mar. 05, 1999
Applicant:
Inventors:

Michael T Kozai, Scarborough, CA;

Ronald Ing, Etobicoke, CA;

William J Jacovich, Newmarket, CA;

Robert Domodossola, Brampton, CA;

Steve Saggese, Bolton, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264335 ; 264336 ; 425547 ; 425552 ; 425556 ;
Abstract

The present invention relates to a device for cooling molded parts and for transporting the molded parts from a receiving position to a holding/ejecting position. The device of the present invention has particular utility with an index molding machine having a rotary turret block with at least two movable mold halves thereon. The cooling device includes a cooling station assembly having a plurality of blowing tubes for applying a cooling fluid to external surfaces of molded parts, a take-off plate having a plurality of holders for receiving cooled molded parts and a connecting plate connecting the take-off plate and the cooling station assembly. The connecting plate is connected to the take-off plate by a pivotable connection and is connected to the cooling station assembly by a rigid connection. The connecting plate is movable along an axis substantially parallel to one of the faces upon which the molded parts to be cooled and removed are positioned. The device further includes a linkage assembly for causing the take-off plate to move between a receiving position and a holding/ejecting position and vice versa. Movement of the take-off plate causes the connecting means to move along the first axis which in turn causes the cooling station assembly to move from a non-cooling position to a cooling position and vice versa. A process for using the device of the present invention as part of a process for molding parts is also described.


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