The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Jun. 25, 1998
Hiroyuki Kimoto, Susono, JP;
Masatugu Nakanishi, Numazu, JP;
Akira Kato, Mishima, JP;
Yoshihiro Yamamura, Nagoya, JP;
Yukio Okochi, Toyota, JP;
Takatoshi Katsumata, Susono, JP;
Toyota Jidosha Kabushiki Kaisha, Tokyo, JP;
Abstract
Embossed metallic flakelets have high damage resistance and can be produced readily. A method for production is also provided. The embossed metallic flakelets are produced by dip-coating an organic-inorganic composite layer 12 on upper and lower sides of a carrier layer made of a PVA film or the like by a sol-gel process, and pressing an original embossed pattern 14 having an embossed pattern against the organic-inorganic composite layer 12 under pressure to transfer the embossed pattern onto the organic-inorganic composite layer 12. A sample having the transferred embossed pattern is sintered, to form a metallic film 10 on the organic-inorganic composite layer 12 by deposition or the like. The organic-inorganic composite layer 12 is dip-coated on the metallic film 10 by a sol-gel process, they are sintered, the carrier layer is dissolved in water to separate the metallic film 10 which is held between the organic-inorganic composite layers 12 on the upper and lower sides of the carrier layer, and the separated metallic film 10 is pulverized into embossed metallic flakelets.