The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2000

Filed:

Jan. 09, 1998
Applicant:
Inventor:

Danny S Moshe, Kiryat Ono, IL;

Assignee:

Malcam Ltd., Tel Aviv, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
324640 ; 73 73 ;
Abstract

A method and system for measuring the moisture content and internal structure of a material which is either packaged as a module or presented in a continues bulk flow. A frequency modulated digital pulse of very high frequency microwaves is directed through the material under analysis by a microwave transmitter. A microwave receiver receives the microwave signal after it exits the material on the opposite side to that of the microwave transmitter. The attenuation and time delay of the exit signal are analyzed and corrected with empirically derived functions so as to calculate the moisture content and density, respectively, of the material. Irregularity of the internal structure of the material is determined by comparing the calculated densities of multiple slices of the material with each other. In an alternative embodiment, the microwave signal is transmitted through the material under analysis by a first satellite dish antenna, and then redirected back through the same slice of material by a second satellite dish antenna located on the opposite side of the material under analysis. The returning signal is received by the first satellite dish antenna, and then processed to calculate the density and moisture of the material in the same manner as described above.


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