The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Sep. 04, 1997
James Thomas Cargo, Bethlehem, PA (US);
Ronald James Holmes, Kissimmee, FL (US);
Ruichen Liu, Warren, NJ (US);
Alvaro Maury, Orlando, FL (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
A method of manufacturing integrated circuits utilizing chemical mechanical polishing (CMP) is disclosed. A dielectric layer, illustratively, having a dopant, dye, etc. termed a 'marker layer' is formed upon a wafer having partially fabricated integrated circuits thereon. An undoped, undyed layer is deposited upon the marker layer. The undoped or undyed layer is polished and the waste slurry is monitored until a signal indicating the exposure of the signal layer is obtained. Analysis of the signal provides an indication of when the CMP process should be terminated.