The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Dec. 09, 1997
Morimasa Tanimoto, Nikko, JP;
Satoshi Suzuki, Nikko, JP;
Akira Matsuda, Utsunomiya, JP;
Kinya Sugie, Takatsuki, JP;
The Furukawa Electric Co., Ltd., Toyko, JP;
Kyowa Electric Wire Co., Ltd., Osaka, JP;
Abstract
A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.