The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Aug. 24, 1998
Kang S Lee, Woodland Hills, CA (US);
Abbas Hosseini, Torrance, CA (US);
Gajendra D Savant, Torrance, CA (US);
Physical Optics Corporation, Torrance, CA (US);
Abstract
A simple, fast, and reliable method and apparatus are provided for replicating a light shaping surface structure on a laminated surface of a relatively rigid substrate. More specifically, after the substrate is mounted on a table and a layer of epoxy is deposited between the substrate and a submaster to produce a layered structure, the layered structure is automatically compressed in a nip formed between the table and an outer surface of a rotating impression roller, thereby replicating the surface structure in the epoxy layer. The epoxy is then cured, and the submaster is separated from the substrate to leave a laminated structure having the light shaping surface structure on a surface thereof. Preferably, the submaster is wrapped around the impression roller, and the impression roller is rotated while the table is reciprocated linearly to compress the layered structure in the nip. In order to prevent slippage between the submaster and the substrate, the rotational speed of the impression roller is matched to the translational speed of the table during the compressing operation--preferably by using the submaster as a drive belt to drive the roller to rotate upon table movement. The replicator preferably also automatically cures the epoxy after the compressing operation and then automatically separates the submaster from the substrate.