The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2000

Filed:

Feb. 28, 1997
Applicant:
Inventors:

James Day, Scotia, NY (US);

Andrew Philip Shapiro, Schenectady, NY (US);

Elihu Calvin Jerabek, Glenmont, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156286 ; 156382 ; 29 2503 ;
Abstract

An improved process for sealing at least one ultracapacitor which includes a multi-layer structure is disclosed. The process includes the step of applying a substantial vacuum to press together an uppermost layer of the structure and a lowermost layer of the structure and to evacuate ambient gasses, wherein a sealant situated in a peripheral area between the facing surfaces of the layers forms a liquid-impermeable seal for the structure under the vacuum. In some embodiments, a press is used to apply pressure to the peripheral area on which the sealant is disposed. Usually, the ultracapacitor would be situated within an enclosable region of the press, and a collapsible membrane would be fastened over the ultracapacitor to fully enclose the region and transmit the vacuum force to the multi-layer structure. The force applied by the press itself causes the sealant to flow, thereby ensuring a complete seal upon curing of the sealant. This process can be employed to seal one ultracapacitor or a stack of at least two ultracapacitors. Another embodiment of this invention is directed to an apparatus for sealing a multi-layer ultracapacitor, comprising the elements described above.


Find Patent Forward Citations

Loading…