The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Nov. 17, 1998
Applicant:
Inventor:
Mieko Suzuki, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ;
U.S. Cl.
CPC ...
451 41 ; 59 63 ; 59288 ; 59290 ; 59398 ;
Abstract
A wafer polishing apparatus includes a carrier and a table. A wafer is mounted on the carrier, and the carrier includes a circumference ring provided around of the wafer. The height of the innermost portion of the circumference ring is equal to or higher than that of a surface of the wafer. The table includes a polishing pad. The carrier and the table are relatively rotated such that the wafer surface is polished by the polishing pad.