The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Sep. 22, 1997
Applicant:
Inventor:
Shinsuke Kunishi, Hadano, JP;
Assignee:
Molex Incorporated, Lisle, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 762 ; 439931 ;
Abstract
A molded electrical interconnection system includes a three-dimensional molded dielectric substrate including at least one open socket. Stamped and formed electrical circuitry is embedded in the molded substrate and includes a contact blade projecting into the socket. An interface module is positioned in the socket to define a receptacle for receiving a male terminal of a complementary connecting device.