The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2000
Filed:
Sep. 17, 1999
Kazuo Nishiyama, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
Disclosed is a semiconductor part improved to enhance the connection strength of land terminals upon mounting of the semiconductor part and to give a sufficient margin to the arrangement pitch of wires passing through the land terminals, a fabrication method thereof, and a structure and method of mounting the semiconductor part. The semiconductor part includes land terminals for bumps (or land terminals provided with bumps), arranged in a grid pattern, which are connected to surfaces of electrode pads via re-arrangement wires on a base; wherein the land terminals for bumps (or land terminals provided with bumps) are classified into outer land terminals arranged on the outer peripheral side of the base and inner land terminals arranged inside the outer land terminals; and the outer land terminals each have a diameter larger than that of each of the inner land terminals and/or have a pitch larger than an arrangement pitch of the inner land terminals.