Leadframe and a method of manufacturing a semiconductor device by use of

Abstract

A leadframe and a method of manufacturing a semiconductor device make it possible to manufacture easily and efficiently such small-size semiconductor devices as have many leads but rarely suffer from short circuits between the leads when mounted on a circuit board. To achieve this, in a leadframe having a plurality of leads, an island for mounting a semiconductor chip, and a tie-bar for joining the leads together, the leads are given bends at their intermediate positions so that the pitch with which they are arranged is greater in a region farther from the island than in a region closer thereto, and the tie-bar is formed between those bends and the island. After the semiconductor chip mounted on the island, together with the portion surrounding it, is sealed in in a resin mold, those portions of the tie-bar which come between the leads are removed by cutting them apart parallel to the side edges of the leads. A projection is formed in a side edge of the island, and this projection is pressed against the stage during wire-bonding.