The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2000
Filed:
Jul. 21, 1998
Masayasu Kojima, Takarazuka, JP;
Saburo Inoue, Tama, JP;
Sumitomo Metal Industries, Ltd., Hyogo, JP;
Abstract
A method for hydroforming a metallic tube comprising primary hydroforming and secondary hydroforming, wherein in the primary hydroforming step, the metallic tube is formed such that a circumferential length of an expanded portion of the primary-hydroformed tube as measured at a wall center region of the expanded portion becomes substantially equal to or slightly shorter than a circumferential length of an expanded portion of a product as measured at a wall center region of the expanded portion, and in the secondary hydroforming step, movable pads incorporated in the dies press the expanded portion formed through primary hydroforming so as to finish the cross-sectional profile of the expanded portion into that of the expanded portion of the product, and said primary hydroforming and secondary hydroforming are continuously performed within the dies. Also disclosed is an apparatus for performing the hydroformation method. According to the method of the present invention, high liquid pressure is not required, and reduction in wall thickness and shape defects can be revented.