The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2000
Filed:
Apr. 16, 1998
Toshiya Ishio, Nara, JP;
Hiroyuki Nakanishi, Kitakatsuragi-gun, JP;
Tomoyo Maruyama, Kitakatsuragi-gun, JP;
Katsunobu Mori, Nara, JP;
Katsuyuki Tarui, Kasaoka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
An insulation material and a wire pattern are provided on at least one of the surfaces of a die pad. Wires of the wire pattern are patterned in such a manner that at least one inner lead included in at least one of two lead groups is electrically connected to an electrode pad provided on the element forming surface of the semiconductor chip near the side edge other than the side edge opposing the lead group including the above particular inner lead, while at least one inner lead included in the other lead group is electrically connected to an electrode pad provided on the element forming surface of the semiconductor chip near the side edge other than the side edge opposing the other lead group. Accordingly, a multichip-1-package semiconductor device using any kind of semiconductor chip can be realized. Also, the costs of the semiconductor device are saved and the semiconductor device can be developed in a shorter period by omitting the design modification of the semiconductor chip.