The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2000
Filed:
Jan. 05, 1999
Applicant:
Inventors:
Christy Woo, Cupertino, CA (US);
Axel Preusse, Austin, TX (US);
Sergey Lopatin, Santa Clara, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ; C25D / ; C23C / ;
U.S. Cl.
CPC ...
205164 ; 205170 ; 205184 ; 205222 ; 205291 ; 205915 ;
Abstract
The reliability of Cu and Cu alloy interconnects is significantly enhanced by controlling the temperature of the electroplating solution during via opening filling to substantially prevent occlusion of the opening. Embodiments of the present invention include electroplating Cu or a Cu alloy from an electroplating solution at a temperature of about 20.degree. C. or less.
Woo, Christy. (2000). Method of forming reliable copper interconnects with improved hole (U.S. Patent No. 6103086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6103086
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile