The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2000
Filed:
Nov. 24, 1998
Applicant:
Inventor:
Makoto Ishimaru, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451285 ;
Abstract
A substrate polishing apparatus is provided with: a turntable (36) having a polishing surface; a plate (11) having an attaching surface to which GaAs semiconductor wafers (12a through 12d) are attached; points (42a through 42d) for adjusting the gap between the GaAs semiconductor wafers (12a through 12d) attached to the plate (11) and the polishing surface of the turntable (36); and notches (16a through 16d) formed so that they extend from the portions of the plate (11), where the points (42a through 42d) are formed, to the circumference of the plate (11). A method for polishing a semiconductor substrate employs the substrate polishing apparatus.