The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2000

Filed:

Oct. 05, 1999
Applicant:
Inventors:

Ming-Wu Lee, Tu-Chen, TW;

Kun-Tsan Wu, Tu-Chen, TW;

Jen-Jou Chang, Yung-Ho, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439736 ;
Abstract

A high-density electrical connector comprises a housing, two sets of SMT contacts insert molded in opposite sides of the housing, and a shield covering the housing. The housing comprises a first housing member and a second housing member surroundingly incorporating the first housing member. A recess is defined between the first and second housing members. A method of manufacturing the high-density connector comprises the steps of: 1) insert molding a pair of SMT contact carriers to opposite sides of the first housing member; 2) insert molding the first housing member having the two SMT contact carriers to the second housing member; 3) severing carrier plates from the two SMT contact carriers; 4) assembling the shield to the housing. The first insert molding forms a base and a crossbeam retaining mounting and mating portions of the SMT contacts with a gap defined therebetween. The base defines a plurality of openings. The second insert molding fills the openings and the gap to incorporate the base and the crossbeam to form the housing.


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