The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
Mar. 04, 1998
Kenji Kanesaka, Tateyama, JP;
Nippon Steel Semiconductor Corporation, Tateyama, JP;
Abstract
In a semiconductor device having a resin-encapsulated structure, the width of an upper-mold portion of a package in a direction parallel to inner leads is made smaller than that of a lower-mold portion of the package so that the upper-mold portion cannot extend further towards outer leads than the lower-mold portion. Therefore, the amount of the positional deviation between an actual package region and a prospective package region is small and tiebars can be arranged close to the prospective package region in a lead frame. Since a fixed distance is ensured between the tiebars and the actual package region after molding, damage to the package is prevented during tiebar cutting. Since the amount of extension of any resin burr is small, a deflashing step is omitted.