The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
Feb. 17, 1998
Naohito Mizuno, Kariya, JP;
Shinichi Hirose, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
An electronic circuit device fabrication method securing a bond width of a seal portion when heat treatment is needed in sealing a device cavity by a cap. An electronic part mounting step is executed to secure electronic parts, including a semiconductor acceleration sensor chip, within a package main body by using a silicone group die bonding material and a silicone group silver paste. At a baking step, the package main body mounted with the electronic part is heated to a baking temperature of about 380.degree. C..+-.5.degree. C. In a sealing step, the package main body and the cap are bonded by a sealing material by executing a heat treatment in a state where the sealing material, comprising a low melting point glass, is interposed between a peripheral edge portion of the cavity in the package main body and the cap. The temperature of the package main body is then heated in the heat treatment to about 365.degree. C..+-.5.degree. C., which is lower than the baking temperature at the baking step.