The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
May. 07, 1998
Manabu Nomura, Ichihara, JP;
Kaoru Wada, Ichihara, JP;
Atsushi Sato, Ichihara, JP;
Tomokazu Abe, Ichihara, JP;
Idemitsu Petrochemical Co., Ltd., Tokyo, JP;
Abstract
Disclosed is a method of molding a fiber-reinforced resin laminate which can manufacture a lightweight laminated molding having excellent mechanical characteristics regardless of the shape of a molding, which can readily unite a surface coat material and a molding while the surface coat material is held in good condition, and which can impart excellent appearance to a laminated molding. Also disclosed is a laminated molding manufactured by the method. The method uses a molding material which contains fiber-containing thermoplastic resin pellets which, in turn, contain reinforcing fibers having a length of 2 mm to 100 mm. The reinforcing fibers account for 5% to 70% by weight of the molding material. A molten resin obtained through the plasticization of the molding material is injected into a die, onto which a surface coat material for covering the surface of a molding is previously attached. After injection of the molten resin into the die cavity is started, a movable die is advanced so as to compress the molten resin contained in the die cavity, followed by expansion of the volume of the die cavity to that of an intended molding.