The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
Apr. 05, 1999
Applicant:
Inventors:
Mikio Nishio, Osaka, JP;
Tomoyasu Murakami, Osaka, JP;
Assignee:
Matsushita Electronics Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ; B24D / ;
U.S. Cl.
CPC ...
451 36 ; 451 41 ; 451 59 ; 451527 ; 451533 ; 451550 ;
Abstract
A polishing pad used for polishing a film on a semiconductor wafer and made of a plastic includes a polishing pad body, and a large number of convex portions, which are provided on the surface of the polishing pad body just like so many islands and each have a flat top surface. An average length L of respective sides or diameters of the convex portions on the top surface thereof is in the range from 0.1 mm to 5.0 mm, both inclusive; an average height H of the convex portions is in the range from 0.1 mm to 0.5 mm, both inclusive; and H.ltoreq.L.ltoreq.2S is met, where S is an average space between the convex portions.