The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2000

Filed:

Sep. 24, 1999
Applicant:
Inventors:

S Sundar Iyer, Beacon, NY (US);

Liang-Kai Han, Fishkill, NY (US);

Robert Hannon, Wappingers Falls, NY (US);

Subramanian S Iyer, Mount Kisco, NY (US);

Mukesh V Khare, White Plains, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438132 ; 438131 ; 438217 ; 438215 ;
Abstract

A low programming voltage anti-fuse formed by a MOSFET (or MOS) or by a deep trench (DT) capacitor structure is described. Lowering the programming voltage is achieved by implanting a dose of heavy ions, such as indium, into the dielectric directly on the substrate or indirectly through a layer of polysilicon. The programming voltage can also be lowered on the MOSFET/MOS capacitor anti-fuse by accentuating the corners of active areas and gate areas of the device with suitable layout masks during processing. Silicon active area corner rounding steps should also be avoided in the fabrication of the anti-fuse to reduce the programming voltage. In the DT capacitor, lowering the programming voltage may be achieved by implanting the node dielectric of the DT anti-fuse with heavy ions either directly or through a conformal layer of polysilicon deposited on it or after the first amorphous silicon recess step during the fabrication of the DT capacitor.


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