The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2000

Filed:

Mar. 25, 1999
Applicant:
Inventors:

Wen-Shiang Liao, Miao Li, TW;

Wan-Yih Lien, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438131 ; 438128 ; 438132 ;
Abstract

A method for controlling the thickness of a passivation layer underlying with a fuse on a semiconductor device is disclosed herein. The anti-reflective coating on a metal layer is buried in the passivation layer, and the fuse is in a semiconductor device. The method includes the following steps. First, use a first etchant and Ar to etch the passivation layer till the anti-reflective coating is exposed, the first thickness of the passivation layer above the anti-reflective coating is smaller than the second thickness of the passivation layer above the fuse. Then, utilize a second etchant to etch the anti-reflective coating till the metal layer is exposed. The second etchant has a selectivity ratio from the anti-reflective coating to the passivation layer being at least 10. The second etchant mentioned above includes BCl.sub.3, Cl.sub.2, O.sub.2, and Ar.


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