The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2000
Filed:
Oct. 16, 1998
JSP Corporation, , JP;
Abstract
A composite material including a polypropylene resin molded body having a melting point MB.degree. C., and a foamed body of expanded particles fuse-bonded to the molded body, wherein the foamed body has at least two endothermic peaks in DSC curve thereof at peak temperatures of 135.degree. C. or more, wherein the highest temperature endothermic peak thereof is at a peak temperature of PH.degree. C. which is not lower than (MB-5).degree. C. and has such an area at temperatures not lower than (MB-5).degree. C. that corresponds to a calorific value in the range of at least 8 J/g, and wherein the peel strength between the molded body and the foamed body is at least 1.5 kg/15 mm. The composite material is produced by molding the expanded particles in a mold cavity in which the molded body is previously placed.