The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2000
Filed:
May. 19, 1998
Frank J Polese, San Diego, CA (US);
Ranganath Saraswati, San Diego, CA (US);
Other;
Abstract
A homogeneous sintered composite made by press-forming a homogeneous mixture of powders of an agglutinating component, a second component having a melting point higher then the agglutinating component, and an exothermically reactive component to form a compact; heating the compact, then inducing an exothermic reaction of the reactive substance which generates sufficient additional heat to melt the agglutinating component without melting the high melting point component. For electronic microcircuit heat-dissipation applications the agglutinating component is a high thermal conductivity metal, and the high melting point component has a low thermal expansivity, whose proportions are adjusted to match the thermal expansion characteristics of microcircuit material. To reduce porosity, the reacted compact is pressed again while the agglutinating component is still in the liquid phase. For low weight applications the second material has high specific thermal conductivity. For filtration media applications, the reacted compact is allowed to cool with or without pressing, leaving a porous final composite. For corrosion resistant media, the agglutinating component is a low refractory metal, and the second material is a refractory metal oxide, carbide or boride.