The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2000
Filed:
Nov. 03, 1997
Philip J Elizondo, San Jose, CA (US);
Kishore K Chakravorty, San Jose, CA (US);
David Caudillo, Saratoga, CA (US);
Candlescent Technologies Corporation, San Jose, CA (US);
Abstract
A method for uniformly depositing of polymer particles onto the surface of a gate metal during the formation of a gate electrode. In one embodiment, the present invention comprises immersing a substrate having a layer of a gate metal disposed over the surface thereof in a fluid bath containing polymer particles. In this embodiment, the fluid bath is contained within a fluid bath tank. Additionally, in the present embodiment, the layer of the gate metal disposed over the substrate has a thickness approximately the same as a desired thickness of the gate electrode to be formed. Next, the present embodiment applies a uniform potential across the surface of the layer of gate metal such that the polymer particles are uniformly deposited onto the layer of the gate metal. In so doing, the present embodiment uniformly deposits the polymer particles onto the layer of the gate metal. In the present embodiment, the polymer particles adhere to the surface of the layer of the gate metal via Van der Waal's forces and/or via a charge difference between the layer of the gate metal and each of the polymer particles. In this embodiment, the polymer particles are deposited over the surface of the layer of the gate metal with a spatial density of approximately 1.times.108 to 1.times.10.sup.12 particles per square centimeter. The present embodiment then removes the substrate having the layer of the gate metal and the particles deposited thereon from the fluid bath.