Control impedance rf pin for extending compressible button interconnect

Abstract

An interconnect structure defining an interconnect transmission line for RF signal interconnection between two substrates. The interconnect structure includes an outer shield member forming an electrically conductive outer shield structure. A solid conductor pin is sized to form an inner conductor, the pin having a first pin diameter, and a head region of a second pin diameter greater than the first pin diameter, said head region formed intermediate a first pin end and a second pin end. A first dielectric tube member has an outer diameter sized in relation to an opening dimension of the shield member to fit tightly therein, and an inner tube diameter sized to receive tightly therein a first region of the pin of the first pin diameter, the first tube member having a first tube first end and a first tube second end. A second dielectric tube member has an outer diameter sized to fit tightly in the outer shield, and an inner tube diameter sized to receive tightly therein a second region of the pin. The tubes fit within the shield to capture the pin head region. Wire bundles fabricated of densely packed wire are packed within the tubes in compression against the ends of the solid conductor pin, and protrude from the ends of the shield for making electrical contact with surfaces of mating substrates.