The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2000

Filed:

May. 06, 1999
Applicant:
Inventors:

Toshikazu Sei, Kawasaki, JP;

Yasunobu Umemoto, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257203 ; 257207 ;
Abstract

First I/O signal pads are arranged along the periphery of a semiconductor chip except corner sections thereof at a first pitch, and second I/O signal pads and power supply pads are arranged in the corner sections of the semiconductor chip. In this case, the second I/O signal pads and the power supply pads are alternately arranged at the first pitch, and arrangement of the power supply pads are set so that the pads are located at fixed sites common to semiconductor chips. With this arrangement, the second I/O signal pads are arranged at a pitch wider than the first pitch.


Find Patent Forward Citations

Sei, Toshikazu. (2000). Semiconductor device with improved pad layout (U.S. Patent No. 6093942). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6093942

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…