The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2000
Filed:
Mar. 25, 1999
Applicant:
Inventors:
Hiroki Ishinaga, Kyoto, JP;
Takehiro Fujii, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257 99 ; 257100 ; 257 88 ;
Abstract
An LED chip component has a resin molding which can be firmly fixed to an insulating substrate even in a case where the exposed area of the insulating substrate cannot be increased any further. To achieve this object, according to a first embodiment, a resin molding is so formed as to flow into (i.e., reach the inside of) a through hole formed in an insulating substrate, and according to a second embodiment, a resin molding is so formed as to flow into two cuts formed respectively at two opposing side edges of an insulating substrate so that the resin molding holds the insulating substrate at two opposing side edges.