The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2000

Filed:

Aug. 13, 1997
Applicant:
Inventor:

Kazuhide Koyama, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438715 ; 438622 ; 438706 ; 438710 ; 438723 ;
Abstract

A process of forming an interconnection of a semiconductor device, which is intended to prevent re-oxidation of a Si-rich layer formed on the surface of an insulating layer when the surface of the insulating layer is subjected to sputter-etch cleaning, whereby the degree of crystal orientation of an interconnection material layer formed on the insulating layer is improved. The process includes a first step of forming an insulating layer made of a silicon based material on a base body; a second step of sputter-etch cleaning the surface of the insulating layer; a third step of depositing an interconnection material layer on the insulating layer by sputtering; and a fourth step of patterning the interconnection material layer on the insulating layer, thereby forming an interconnection; wherein the sputter-etch cleaning in the second step is performed while the base body is cooled.


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