The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2000
Filed:
Jun. 01, 1998
Applicant:
Inventors:
Prosanto K Mukerji, Phoenix, AZ (US);
Rajesh Srinivasan, Scottsdale, AZ (US);
Ronald E Thomas, Tempe, AZ (US);
Colin B Bosch, Phoenix, AZ (US);
Peter J Gillespie, Chagrin Falls, OH (US);
Assignee:
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438113 ; 438106 ; 438110 ;
Abstract
A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.