The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2000
Filed:
Aug. 29, 1997
Applicant:
Inventor:
Masaaki Kinoshita, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257786 ; 257723 ;
Abstract
A semiconductor pellet comprising first and second semiconductor chips being diced from a wafer, a first bonding-pad formed at a first peripheral portion of said first chip, and a second bonding-pad formed at second peripheral portion of said second chip, which bonding-pads are arranged so as to keep symmetry after rotating around the central point of said pellet by 180 degrees. Judging whether the first chip is good or not and if the chip is not good, then the pellet is rotated around the central point thereof by 180 degrees, and it is mounted onto a chip carrier. Then wire-bonding is conducted.