The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2000
Filed:
Sep. 26, 1997
Masaki Adachi, Yokohama, JP;
Isao Ogawa, Kitakyushu, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor device comprising a package formed of a thermoplastic resin, first and second lead frames arranged parallel to each other with a predetermined space interposed therebetween, and each having a distal end portion of a predetermined length located in the package, solder films formed on the first and second lead frames from outside the package to inside the package, a semiconductor element mounted on the distal end portion of the first lead frame and having an electrode, and a bonding wire having an end connected to the electrode of the semiconductor element, and another end connected to the distal end portion of the second lead frame.