The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2000
Filed:
Aug. 14, 1998
Tokushi Sakamoto, Yamanashi-ken, JP;
Chiharu Isobe, Yamanashi-ken, JP;
Enomoto Co., Ltd., Yamanashi-ken, JP;
Abstract
A semiconductor device manufacturing method and a semiconductor lead frame and its manufacturing method are disclosed. The semiconductor lead frame, in one form, comprises a chip pad section on which a semiconductor chip is mounted and a lead section including inner leads that are wire-bonded to electrodes of the semiconductor chip and outer leads that protrude out from the lead frame after packaging. Further, when the pad section and the lead section are connected together using a folding portion, which has not been folded, then the chip pad section sits apart from the lead section without overlapping. When the folding portion is folded, the ends of the inner leads of the lead section overlap the chip pad section and are located around a semiconductor chip mounting position of the chip pad section. Other forms of the semiconductor lead frame and various forms of the above-mentioned manufacturing methods are also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile