The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2000

Filed:

Jul. 07, 1998
Applicant:
Inventor:

Takehiro Fujii, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257 82 ; 257 94 ; 257 96 ; 257 97 ; 257 99 ; 438 26 ; 438 39 ; 438 47 ;
Abstract

A semiconductor light emitting device has a light emitting chip and a conductive member. A light emitting chip is formed by an insulating substrate. A semiconductor layered portion has semiconductor layers forming a light emitting layer grown on the insulating substrate. A first electrode (p-side electrode) is formed in electrical connection with a first conductivity type semiconductor layer on a surface side of the semiconductor layered portion. A second electrode (n-side electrode) is formed in electrical connection with a second conductivity type semiconductor layer at a position exposed by partly etching the semiconductor layered portion. The light emitting chip is adhered at a backside of the insulating substrate to the conductive member through a conductive adhesive, and the conductive member is electrically connected to the second electrode.


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