The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2000
Filed:
Nov. 18, 1998
Hatsuyuki Arai, Ayase-shi, JP;
Xu Jin Wang, Ayase-shi, JP;
Other;
Abstract
The present invention provides a polishing pad having a double-layer structure that allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighborhood of its outer circumference. A polishing pad consists of a hard upper-layer member 11 having a lower compression rate and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, and an adhesive layer 13 interposed between both members to adhere them together, wherein a plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm or less and that groove depth is at least half or more the thickness of the upper-layer member.