The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2000
Filed:
Jul. 12, 1999
Nippon Pillar Packing Co., Ltd., Osaka, JP;
Abstract
A polishing pad that can polish the surface of work pieces, such as semiconductor silicon wafers, with satisfactory results. Polishing pad 1.sub.1 is formed of a large number of resin polishing elements 11, all tubular with a very small diameter, inseparably bound together, outer peripheral surface to outer peripheral surface, with the axial direction tube end faces aligned on a plane, to form a plate structure 10 with two kinds of pores 12, 13, which are regularly positioned and run through the plate structure 10 in the thickness direction. Pad surface 1a of polishing pad 1.sub.1 is formed by the axial direction tube end faces of polishing elements 11 . . . . First pore 12 is the center pore in the polishing element 11. Second pore 13 is formed between the outer peripheral surfaces of the polishing elements 11 . . . .